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| ? 2010 microchip technology inc. ds51873b xlp 16-bit development kit user?s guide
ds51873b-page 2 ? 2010 microchip technology inc. information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mxdev, mxlab, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. analog-for-the-digital age, appl ication maestro, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mplab certified logo, mplib, mplink, mtouch, octopus, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, total endurance, tsharc, uniwindriver, wiperlock and zena are trademarks of microchip tec hnology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. all other trademarks mentioned herein are property of their respective companies. ? 2010, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 978-1-60932-284-7 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the mo st secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specifications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconductor manufacturer c an guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvi ng the code protection features of our products. attempts to break microchip?s c ode protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. xlp 16-bit development kit user?s guide ? 2010 microchip technology inc. ds51873b-page 3 table of contents preface ....................................................................................................................... .... 5 chapter 1. introduction to the xlp 16-bit board 1.1 introduction ................................................................................................... 11 1.2 highlights ...................................................................................................... 11 1.3 what?s in the kit ........................................................................................... 12 1.4 development board features ...................................................................... 12 1.5 using the development board out of the box ............................................. 13 1.6 demonstration program ............................................................................... 14 1.7 reference documents .................................................................................. 14 chapter 2. the xlp demonstration application 2.1 initial setup ................................................................................................... 15 2.2 demonstration program operation .............................................................. 17 chapter 3. xlp 16-bit development board hardware 3.1 introduction ................................................................................................... 21 3.2 hardware features ....................................................................................... 21 3.3 current measurement .................................................................................. 27 appendix a. development kit schematics ............................................................... 29 index ......................................................................................................................... .... 35 worldwide sales and service .................................................................................... 36 xlp 16-bit development kit user?s guide ds51873b-page 4 ? 2010 microchip technology inc. notes: xlp 16-bit development kit user?s guide ? 2010 microchip technology inc. ds51873b-page 5 preface introduction this chapter contains general information that will be useful to know before using the xlp 16-bit development board. items discussed in this chapter include: ? document layout ? conventions used in this guide ? warranty registration ? recommended reading ? the microchip web site ? development systems customer change notification service ? customer support ? document revision history document layout this document describes how to use the xlp 16-bit development board as a develop- ment tool to emulate and debug firmware on a target board. the manual layout is as follows: ? chapter 1. introduction to the xlp 16-bit board provides a brief overview of the xlp 16-bit development board, its features and its uses ? chapter 2. the xlp demonstration application describes the preprogrammed demonstration program ? chapter 3. xlp 16-bit development board hardware provides a more detailed description of the xlp 16-bit board?s hardware features ? appendix a. development kit schematics provides detailed schematics of the xlp 16-bit development board notice to customers all documentation becomes dated, and this manual is no exception. microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. please refer to our web site (www.microchip.com) to obtain the latest documentation available. documents are identified with a ?ds? number. this number is located on the bottom of each page, in front of the page number. the numbering convention for the ds number is ?dsxxxxxa?, where ?xxxxx? is the document number and ?a? is the revision level of the document. for the most up-to-date information on development tools, see the mplab ? ide on-line help. select the help menu, and then topics to open a list of available on-line help files. xlp 16-bit development kit user?s guide ds51873b-page 6 ? 2010 microchip technology inc. conventions used in this guide this manual uses the following documentation conventions: documentation conventions description represents examples arial font: italic characters referenced books mplab ? ide user?s guide emphasized text ...is the only compiler... initial caps a window the output window a dialog the settings dialog a menu selection select enable programmer quotes a field name in a window or dialog ?save project before build? underlined, italic text with right angle bracket a menu path file>save bold characters a dialog button click ok a tab click the power tab text in angle brackets < > a key on the keyboard press preface ? 2010 microchip technology inc. ds51873b-page 7 warranty registration please complete the enclosed warranty registration card and mail it promptly. sending in the warranty registration card entitles users to receive new product updates. interim software releases are available at the microchip web site. recommended reading this user?s guide describes how to use xlp 16-bit development board. other useful documents are listed below. the following microchip documents are available and recommended as supplemental reference resources. readme for xlp 16-bit development board for the latest information on using the xlp 16-bit development board, refer to the file, readme.pdf , in the ?documentation? subdirectory (inside the ?xlp 16-bit develop- ment board demo? directory). this file contains update information and known issues that may not be included in this user?s guide. pic24f16ka102 family data sheet (ds39927) consult this document for detailed information on the pic24f k-series flash device that is pre-installed in the development kit. reference information found in this data sheet includes: ? device memory map ? device pinout and packaging details ? device electrical specifications ? list of peripherals included on the device pic24f family reference manual this reference manual explains the operation of the pic24f microcontroller family architecture and peripheral modules. the specifics of each device family are discussed in the individual family?s device data sheet. this useful manual is on-line in sections at the technical documentation section of the microchip web site. refer to these sections for detailed information on pic24f device operation. 16-bit mcu and dsc programmer?s reference manual (ds70157) this manual is a software developer?s reference for all of microchip?s 16-bit microcontrollers. it describes the instruction set in detail and also provides general information to assist in developing software for pic24, dspic30 and dspic33 mcus. xlp 16-bit development kit user?s guide ds51873b-page 8 ? 2010 microchip technology inc. the microchip web site microchip provides online support via our web site at www.microchip.com . this web site is used as a means to make files and information easily available to customers. accessible by using your favorite internet browser, the web site contains the following information: ? product support ? data sheets and errata, application notes and sample programs, design resources, user?s guides and hardware support documents, latest software releases and archived software ? general technical support ? frequently asked questions (faqs), technical support requests, online discussion groups, microchip consultant program member listing ? business of microchip ? product selector and ordering guides, latest microchip press releases, listing of seminars and events, listings of microchip sales offices, distributors and factory representatives development systems custome r change notification service microchip?s customer notification service helps keep customers current on microchip products. subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. to register, access the microchip web site at www.microchip.com , click on customer change notification and follow the registration instructions. the development systems product group categories are: ? compilers ? the latest information on microchip c compilers and other language tools. these include the mplab ? c18 and mplab c30 c compilers; mpasm? and mplab asm30 assemblers; mplink? and mplab link30 object linkers; and mplib? and mplab lib30 object librarians. ? emulators ? the latest information on microchip in-circuit emulators.this includes the mplab ice 2000 and mplab ice 4000. ? in-circuit debuggers ? the latest information on the microchip in-circuit debugger, mplab icd 3 and pickit? 3. ? mplab ? ide ? the latest information on microchip mplab ide, the windows ? integrated development environment for development systems tools. this list is focused on the mplab ide, mplab sim simulator, mplab ide project manager and general editing and debugging features. ? programmers ? the latest information on microchip programmers, such as the mplab pm3 device programmer. preface ? 2010 microchip technology inc. ds51873b-page 9 customer support users of microchip products can receive assistance through several channels: ? distributor or representative ? local sales office ? field application engineer (fae) ? technical support customers should contact their distributor, representative or field application engineer (fae) for support. local sales offices are also available to help customers. a listing of sales offices and locations is included in the back of this document. technical support is available through the web site at: http://support.microchip.com document revision history revision a (october 2009) ? initial release of this document. revision b (june 2010) ? revises section 2.1 ?initial setup? with a simplified installation procedure, reflecting the inclusion of driver software in the software installation package. ? revises section 2.2 ?demonstration program operation? with a modified application description and new application flow diagram for the current revision of the demo application. ?adds section 2.2.1 ?demo program configuration? to describe configuration options in the most current revision of the demo application. ? revises chapter 3. ?xlp 16-bit development board hardware? with additional information on compatible pictail plus daughter boards and a new current measurement cable. ? corrects the icd/icsp? connectors in figure a-1 of appendix a.?development kit schematics? . ? other minor typographic corrections throughout. xlp 16-bit development kit user?s guide ds51873b-page 10 ? 2010 microchip technology inc. notes: xlp 16-bit development kit user?s guide ? 2010 microchip technology inc. ds51873b-page 11 chapter 1. introduction to the xlp 16-bit board 1.1 introduction thank you for purchasing microchip technology?s xlp 16-bit development board kit. the board provides a low-cost, highly configurable development system for microchip?s new line of pic24f 20 and 28-pin extreme low-power (xlp) microcontrollers, including the pic24f16ka102 and pic24fj64ga102 families. the xlp 16-bit board permits users to explore and evaluate extreme low-power features, and learn low-power software and hardware techniques. various headers are available to measure both microcontroller and component power consumption. it is flexible, supporting six different power sources over a wide voltage range. it is highly configurable, equipped with a variety of common peripheral components that can be selectively enabled. finally, it is expandable through its modular interface, providing for the addition of advanced interfaces and connectivity methods. as provided, the xlp 16-bit development board functions as a demonstration platform on initial power-up. the included demonstration software takes a temperature measurement, datalogs information to the serial data eeprom and displays informa- tion to a host pc via a usb connection. additional software is provided to demonstrate low-power techniques and ic interface routines. 1.2 highlights the xlp 16-bit development board includes these features: ? support for both 20-pin and 28-pin versions of both pic24f j-series and k-series flash microcontrollers ? accommodations for six different power source options ? configurability for a wide range of operating voltages (1.8v to 5.5v) ? configuration selection jumpers to disable board components ? a hardware switchable option to control power to board components with port pin ? usb connectivity ? provisions to add rs-232 transceivers (not populated) ? five user-defined buttons (3 capacitive touch and 2 push buttons) ? two user-defined leds ? two temperature sensors ? potentiometer for analog input or high/low voltage detect (hlvd) reference ? built-in capability for separately measuring microcontroller and component current consumption ? support for all microchip compatible programmers and emulators xlp 16-bit development kit user?s guide ds51873b-page 12 ? 2010 microchip technology inc. 1.3 what?s in the kit the xlp 16-bit development board kit includes the following: ? xlp 16-bit development board with a preprogrammed pic24f16ka102 microcontroller installed ?usb mini-b cable 1.4 development board features a layout of the xlp 16-bit development board is shown in figure 1-1. the board includes these specific features, as indicated in the diagram: 1. shared footprint 20-pin and 28-pin (300 mil pdip) sockets for pic24f microcontrollers, plus associated headers 2. oscillator circuits (8 mhz and 32.768 khz) for pic24f microcontrollers 3. power supply area (battery holders, external power supply input, ldo regulator and power supply select jumper) a) interface headers for energy harvester demonstration kits 4. ic power control switch (ic pwr) 5. power led 6. adjustable ldo regulator 7. pic24f on-chip regulator configuration switch and circuitry 8. ic power select jumpers 9. pic24f master clear switch 10. capacitive touch pads 11. user-defined push buttons 12. potentiometer 13. user-defined leds 14. serial eeprom 15. temperature sensors 16. capacitive measurement point 17. usb interface (usb/uart transceiver, pic18f oscillator and usb port) 18. unpopulated rs-232 options area 19. programming interfaces: a) mplab icd 2 6-wire interface (rj-11 socket) and separate pic18 icsp? header b) pickit? programmer 6-pin interface 20. modular 28-pin riser interface for daughter boards 21. prototype area with supply voltage and i 2 c? signal access 22. current measurement jumpers and access point a more detailed discussion of each feature and its configuration is provided in chapter 3. ?xlp 16-bit development board hardware? . introduction to th e xlp 16-bit board ? 2010 microchip technology inc. ds51873b-page 13 figure 1-1: xlp 16-bit board component layout 1.5 using the development board out of the box although intended as a development platform, the xlp 16-bit board may also be used directly from the box as a demonstration platform for the preprogrammed pic24f16ka102 microcontroller. refer to chapter 2. ?the xlp demonstration application? for details on the demonstration code operation. m 1 4 5 6 8 9 7 10 11 12 13 14 16 17 18 19a 20 2 15 3 19b 3a 21 22 xlp 16-bit development kit user?s guide ds51873b-page 14 ? 2010 microchip technology inc. 1.6 demonstration program the preprogrammed example code on the pic24f16ka102 device is available for download from the microchip web site (www.microchip.com/xlp16bitboard ). all required project files are provided, so that the code may be used as an example or a platform for further development. these may be used with the included pic24f16ka102 device by programming the device using an mplab icd 2 programmer/debugger, pickit? starter kit or any other microchip programming tool. in addition, the firmware for the usb-to-serial emulator that is preloaded on the pic18f14k50 microcontroller, is also provided. both source code (in c) and compiled code files (in hex format) are included. 1.7 reference documents in addition to the documents listed in the ?recommended reading? section, these documents are also available from microchip to support the use of the xlp 16-bit development board: ? ?25aa256/25lc256 256k spi bus serial eeprom? data sheet (ds21822) ? ?mcp9700/9700a/9701/9701a low-power linear active thermistor? ics? data sheet (ds21942) ? ?pickit? 2 programmer/debugger user?s guide? (ds51553) ? ?pickit? 3 programmer/debugger user?s guide? (ds51795) ? ?mplab ? icd 2 in-circuit debugger quick start guide? (ds51268) ? ?mplab ? real ice? in-circuit emulator user?s guide? (ds51616) ? ?compiled tips ?n tricks guide? (ds01146) ? ?pic24f family reference manual?, section 11. ?charge time measurement unit (ctmu)? (ds39724) xlp 16-bit development kit user?s guide ? 2010 microchip technology inc. ds51873b-page 15 chapter 2. the xlp demonstration application this chapter describes the demonstration application that is preprogrammed on the pic24f microcontroller, which shows the use of low-power techniques in a working application. in the process, the application highlights various features of the pic24f microcontroller family. 2.1 initial setup although intended as a development platform, the xlp 16-bit board is also designed to be used directly from the box as a demonstration platform. the demonstration firmware preprogrammed into the pic24f16ka102 microcontroller is ready for immediate use. the demonstration firmware uses a usb-to-rs-232 converter to communicate with the pc via a standard serial interface. in order to use the board with a pc, a serial terminal program will be required. the open source program, realterm, is included with the demo software and can be used to communicate to the board. 2.1.1 configuring and connecting the hardware to get started with the board, verify that it is properly configured: 1. verify the pic24f16ka102 is correctly installed into socket, u1. the notch on the edge of the device package will be toward the top of the board. 2. verify that s4 is in the ?pic24k? position. 3. ensure the ic pwr switch is in the ?rb2? position. 4. populate the pic pwr and ic pwr jumpers. 5. select ?ext ps/usb? with the power source select jumper. 6. select the ?mcp9700? temperature sensor option with the temp sense jumper. 7. populate the temp, see and pot jumpers. 2.1.2 installing the software and driver before connecting the board to the pc, install the driver by running the installation file downloaded from the microchip website. this setup utility will install the source and documentation to the indicated location, and install the usb to rs-232 emulation drivers. after the installation completes, connect the development board to the pc with the provided usb cable (a to mini-b), as shown in figure 2-1. the drivers will automatically be located and installed by the operating system. note: for windows xp, one or more dialogs may warn that the driver has not been digitally signed. this is normal. click ok to proceed through the dialogs. xlp 16-bit development kit user?s guide ds51873b-page 16 ? 2010 microchip technology inc. figure 2-1: starter kit setup once the driver installation finishes, it is necessary to determine the com port number that has been assigned. to do this in windows, open device manager (from the control panel, click on the system applet, select the hardware tab, then click on device manager ). in the default view (device by connection), check under ?ports (com & lpt)? for the newly added com port. the actual number of the new com port will vary depending on the hardware configuration of the system prior to driver installation. 2.1.3 configuring the serial terminal with the board connected and the usb driver installed, the only remaining task is to configure the terminal session. the required com port settings are: ? bits per second: 1,000,000 ?data bits: 8 ? parity: none ? stop bits: 1 ? flow control: none. at this point, the terminal is connected to the xlp board and communicating through the emulated serial port. it may be necessary to press s1 (master clear) to reset to the pic24f microcontroller and obtain a display. a to mini-b usb cable development board m note: if the serial terminal software being used does not support this baud rate, it will be necessary to change the default baud rate for the firmware and reprogram the board. the xlp demonstration application ? 2010 microchip technology inc. ds51873b-page 17 2.2 demonstration program operation the demonstration program uses the on-board rs-232 to usb converter to send system status data in serial form to a standard serial terminal (figure 2-2). it permits the user to select which sensor information is displayed and to choose the micro- controller?s low-power mode. this permits users to experiment with various low-power and xlp techniques, as well as make direct measurements.the program flow is shown in figure 2-3. figure 2-2: serial terminal display for the demonstration application on power-up, the pic24f16ka102 device will wake-up every 10 seconds from a real-time clock calendar (rtcc) interrupt, then re-enter sleep mode. while awake, the microcontroller takes a temperature measurement using the mcp9700 tempera- ture sensor and writes the information to the serial eeprom. status information is displayed, including the wake-up source, low-power mode, selected sensor, data eeprom information and current temperature. in the default por configuration, the rtcc interrupt is the wake-up source, while the mcp9700 is the active sensor. push button switches, s2 and s3, can perform multiple functions depending on the code configuration and how long they are depressed. to minimize power, these switches use internal pull-ups which are disabled in software when not in use. pressing s2 forces a sample to be taken immediately on the selected sensor. this information is displayed on the terminal window. pressing s3 disables the output to the screen. this permits power measurements with- out the additional current consumed by the uart. pressing s3 again enables the uart and permits information to be displayed again. pressing and holding s2 for more than two seconds selects the sensor input. repeated presses cycle between the temperature sensor, potentiometer, capacitive touch pads and all three sensors at once. the display reflects each new sensor selection. when the potentiometer is selected, both v dd and current potentiometer voltages are shown. when the touch pads are selected, their real-time status is displayed. when all three sources are active at once, all of the sensor information is displayed at one time. xlp 16-bit development kit user?s guide ds51873b-page 18 ? 2010 microchip technology inc. figure 2-3: demo appl ication software flow process wake-up or reset source button press? transmit stored eeprom data reset sample active sensors store sensor data to eeprom uart enabled? transmit current sensor data enter low-power mode force sample switch active sensor toggle uart transmit switch low-power s2 press s3 press s3 hold n y erase datalog button press? s3 press s2 press s2 hold mode the xlp demonstration application ? 2010 microchip technology inc. ds51873b-page 19 when the capacitive sense pads are active, the device wakes up more often (once per second). in addition, data is only stored to the eeprom when a capacitive touch event is detected. the same is true when all sensors are active. pressing and holding s3 for more than two seconds selects between sleep, deep sleep and idle modes for the pic24f microcontroller. in deep sleep, most micro- controller functions are disabled to minimize power consumption. the available wake-up sources supported by the xlp 16-bit development board are rtcc interrupt, external interrupt 0 (int0) and mclr reset. when idle mode is selected, all peripherals continue to operate; however, program memory is disabled and code execution is stopped to reduce power consumption. because of the limited number of wake-up sources available in deep sleep mode, s3 can not wake the microcontroller. however, s1 (mclr reset) and s2 (connected to int0) can wake up the device. the rtcc interrupt will continue to periodically wake-up the microcontroller every 10 seconds. the display indicates which wake-up source is used to exit deep sleep mode. holding s2 while resetting the device resets the datalog, restarting the eeprom address counter at 00h. holding s3 while resetting the device outputs the eeprom contents via the uart. the output consists of a data log of time-stamps from the rtcc and the sensor measurements taken at that time. 2.2.1 demo program configuration the demonstration software has a number of configuration options to allow it to be used in a number of low-power applications. these are implemented in the application source code using #ifdef statements. there are two projects which share configuration options: ? the xlp16demo project, which implements the full functionality of the board for a typical low-power application powered by a battery. ? the xlpehdemo project, customized for use with an energy harvester as a power supply. eight configuration options are available: ? use_pwrctl enables the control of power to external circuits dynamically via an i/o pin driving the gate of a fet. this allows the code to disable power consuming external devices when they are not in use, such as when the device is asleep. with this define, the firmware dynamically enables and disables external devices as they are used. ? use_pwrctl_oneshot is an alternative to use_pwrctl . this option enables and disables external devices only once per loop. external devices are powered on when the microcontroller wakes from sleep and powered off after completing the loop, but before entering sleep. this option is provided for low-power applica- tions which have restrictions on the peak current available, as dynamic power control of the external devices can cause undesired current spikes. ? use_button_hold enables the firmware to detect when a user presses and holds s2 or s3 for a specific amount of time. the held-button detection algorithm is implemented to consume as little power as possible. however, due to the length of time required to detect a button press and release, it may consume too much power for some applications. these applications can disable held-button detection to maintain minimal power consumption. note: while the capacitive touch pads are enabled, the demo application will enter sleep mode instead of deep sleep; this permits the touch pads to remain active and exit the low-power mode. xlp 16-bit development kit user?s guide ds51873b-page 20 ? 2010 microchip technology inc. ? use_captouch enables the capacitive touch sensing algorithm. effective cap touch sensing requires a fast response time (about 100 ms), which can drain too much power for some applications. this setting allows capacitive touch sensing to be disabled so that it is not used as part of the sensor mode cycle. ? use_harvester enables energy harvester state-of-charge monitoring. when enabled, the firmware tracks the charge state of the energy harvester and attempts to manage available power to prevent fully discharging the battery. ? default_mode sets the default low-power mode, selecting between sleep, deep sleep and idle modes. if held-button detection is enabled, the low-power mode can be changed at run time; otherwise, the selected mode is always used. ? default_sensor sets the default sensor, selecting between temperature, potentiometer voltage, capacitive touch sensors and all sensors. if held-button detection is enabled, the sensor can be changed at run time; otherwise, the selected sensor is always used. ? default_tx sets the default transmitter setting. if true, the demo will have uart transmissions enabled by default. if false, they are disabled. the state of the transmitter can always be changed at run time by pressing s3. xlp 16-bit development kit user?s guide ? 2010 microchip technology inc. ds51873b-page 21 chapter 3. xlp 16-bit development board hardware 3.1 introduction this chapter provides a more detailed description of the hardware features of the xlp 16-bit development board. 3.2 hardware features the key features of the xlp 16-bit board are listed below. they are represented in the order given in section 1.4 ?development board features? and figure 1-1. 3.2.1 pic24f processor support the xlp 16-bit board has been designed to accommodate pic24f microcontrollers in both 20-pin and 28-pin 300 mil pdip packages. all pin signals on both sockets are also available for external monitoring on the 14-pin headers (j1 and j2), located on either side of the sockets. 3.2.1.1 feature availability by pic24f device family the high degree of pin compatibility between pic24f device families makes it possible for the xlp 16-bit development board to support many low pin count devices. how- ever, there are a few minor pinout differences between families that make it difficult to create a universal board. of all of the board?s features described in this chapter, only three are not universally available to all pic24f microcontrollers. these are summa- rized in table 3-1, with details provided in subsequent sections. any feature that is not listed here is implemented uniformly for all pic24f device families that are supported by the development board. table 3-1: features that are not universally available 3.2.2 pic24f oscillator options the installed microcontroller has two separate oscillator circuits connected. the main oscillator uses an 8 mhz crystal (y1) and functions as the primary oscillator. a second circuit, using a 32.768 khz crystal (y2), functions as the timer1 oscillator, and serves as the source for the rtcc and secondary oscillator. pic24f device family board feature potentiometer d3 (yellow) 28-pin modular connector 28-pin j-series (note 1) n y 28-pin k-series y y y 20-pin k-series y y n note 1: functions as an a/d potentiometer only on these devices, and as an a/d and hvld reference potentiometer on all others. xlp 16-bit development kit user?s guide ds51873b-page 22 ? 2010 microchip technology inc. 3.2.3 power sources the xlp 16-bit board can use any one of six power options for full operation: 1. bus power via the usb connector (j9). this provides a nominal 5v power source, regulated to approximately 3.3v for the microcontroller and board com- ponents, through a schottky diode and low dropout (ldo) regulator circuit (d7, q1). the green power led (d5) is illuminated when this power source is used and bus power is present. 2. an unregulated supply of 9 vdc nominal (range of 5v to 12v) is supplied to j6. for default functionality, a center hot power supply with a current capability of 100 ma is sufficient. a larger power supply can be used, up to 700 ma, and may be needed to support pictail accessories. this voltage is fed into the on-board regulator. the green power led is illuminated when this power source is used and power is present. 3. two aaa batteries (not included) installed in bt2. the output voltage is not regu- lated by the ldo, so the microcontroller and board run at the voltage provided by the battery pair. to minimize current consumption, the power led is not illuminated for this power source. 4. a cr2032 coin cell battery (not included) installed in bt1. as with the aaa battery option, the microcontroller and board run directly from the 3v nominal battery voltage and the power led is not illuminated. 5. two headers (one 5-pin, one 6-pin 0.05? pitch) are provided to connect with exter- nal energy harvesting development systems. the headers are industry standard sizes commonly used with energy harvesting applications. if you plan to use an energy harvesting system, verify pin compatibility before proceeding. 6. an external, regulated dc power supply connected to the vdd src and one of the gnd test points. voltage is supplied to board and microcontroller without volt- age drops or voltage regulation; therefore, supply voltage must meet the voltage requirements for the installed pic24f device. the power led does not illuminate in this configuration. the installed pic24f16ka102 operates between 1.8v to 3.6v. refer to the appropriate device data sheet for other devices. a four-way jumper block, power source select (j12), selects the power supply option. the available options are usb/ext pwr, aaa, 2032 and harvest (methods 1 through 5, above). the default configuration (as shipped) is usb power mode. the jumper block does not control external power applied directly to the board (method 6), since the test point is located in the circuit after the block. 3.2.3.1 component power switch the component power switch, ic pwr (s7), allows for software-enabled control of power by the pic24f device to many of the board components. when the switch is in the ?rb2? position, the rb2 port pin can control power to components using a p channel fet switch (u3). this permits experimentation with a popular technique to reduce an application?s power consumption and extend battery life. when the switch is in the ?on? position, component power is selected only by the corresponding component select jumper. see section 3.2.4 ?component select jumpers? for additional information. note 1: the xlp 16-bit development kit does not include a power supply. if an external supply is needed, use microchip part number ac162039. 2: the regulated power supply options are provided for easier development. power consumption by a regulator circuit is not included in board power measurement. xlp 16-bit development board hardware ? 2010 microchip technology inc. ds51873b-page 23 3.2.3.2 power led the green power led (d9) illuminates when power is supplied from either the external 9v power supply or the usb connector. 3.2.3.3 adjustable supply voltages the ldo regulator (q1) is adjustable, and can support a wide voltage range for both board component and microcontrollers. it can be configured between 1.8v to 5.5v by changing the values of the voltage divider formed by r28 and r29. typical values are listed in table 3-2. the equation relating the resistor values to target v dd is provided in figure a-3 of section appendix a. ?development kit schematics? . as shipped, the ldo is configured to supply 3.3v. the typical drop of the ldo is approximately 1.75v. ensure the fixed power supply or usb supply voltage exceeds the desired microcontroller voltage by at least this amount. the performance of the mcp9700 and the leds is diminished at 1.8v operation. if rs-232 communication is needed at 1.8v, populate the ltc2801 and associated components. see section 3.2.14 ?rs-232 serial port options? for more information. table 3-2: resistor values for r28/r29 voltage divider 3.2.3.4 on-chip regulator configurations (pic24f j-series) the xlp 16-bit board supports multiple regulator configurations for pic24f devices with an internal voltage regulator. a slider switch (s4) allows the user to configure the board for either j-series or k-series flash devices. with switch, s4, in the ?pic24fj? position, the microcontroller?s internal voltage regulator is enabled by connecting a pull-down resistor to the disvreg pin and a 10 f capacitor to the v cap pin. for pic24f j-series devices, additional power savings can be achieved by disabling the regulator. three methods are supported by making several component changes to the ?pic24f vreg? section of the pcb: ? separate power supply for v dd and v ddcore ?v ddcore and v dd connected together ?v ddcore connected through a zener diode to v dd the required component changes are summarized in table 3-3. table 3-3: component changes for disabling on-chip regulator note: always verify that the voltage selected on the ldo meets the v dd specification of the installed pic24f device. component target v dd 1.8v 3.3v 5.0v r28 150 ? 120 ? 75 ? r29 450 ? 200 ? 33 ? j-series regulator option component placement and value r3 r4 r5 c4 d6 v cap test point split v dd and v ddcore np np 1 k ? np np v ddcore same v dd and v ddcore 0 ? np n/c v ddcore zener diode np p n/c legend: np = not populated; p = populated xlp 16-bit development kit user?s guide ds51873b-page 24 ? 2010 microchip technology inc. 3.2.4 component select jumpers a bank of jumpers is available to selectively enable various board components. these jumpers, located in the ?power control? block on the board, permit the user to perform customized power management analysis and configure the board more closely to the user?s application. by removing the jumper for a component, power is disconnected to the designated ic and supporting circuitry, eliminating power consumption to these components. see section 3.3.2 ?component power measurement? for more information on power monitoring. when the ic pwr switch is set to the ?rb2? position, the component select jumpers determine which components are under software control. any component not selected by its corresponding jumper remains disabled. component select jumpers are implemented for: ? serial eeprom (jp2) ? modular expansion header (jp6) ? mcp9700 thermistor (jp1) ? adc/hlvd potentiometer (jp3) an additional jumper (jp7) selects power for the unpopulated rs-232 serial circuitry. see section 3.2.14 ?rs-232 serial port options? for more information. 3.2.5 master clear reset (mclr ) switch the mclr switch (s1) is an active-low switch with a pull-up. it resets the pic24f microcontroller in either socket. it does not reset the pic18f14k50 microcontroller used for usb communication. therefore, usb communication is not affected by this switch. 3.2.6 capacitive touch pads three capacitive touch pads, based on the charge time measurement unit (ctmu), are available. they are multiplexed to three separate analog channels (table 3-4). in many capacitive touch applications, an overlay is used to protect the pcb. mounting holes are provided to secure overlay materials for evaluation. the low pin count devices, supported by the xlp 16-bit board, require that the touch pads be multiplexed with other board components. specifically, ct2 is multiplexed with the temperature sensor circuitry, while ct3 is shared with the ?cap sense? socket with the c3 designator. to avoid interference with the pads, observe the modifications noted in table 3-4. table 3-4: capacitive touch pad analog input assignments cap touch button analog input note 1an5 2 an1 remove jp5 3 an0 unpopulate c3 socket xlp 16-bit development board hardware ? 2010 microchip technology inc. ds51873b-page 25 3.2.7 user-defined switches two push button switches (s2 and s3) are provided for user-defined digital inputs. they are connected to the i/o pins shown in table 3-5. when pressed, they pull the respective port pin to ground. using these switches requires the corresponding pin?s internal weak pull-ups be enabled. when the switches are not required, the pull-ups can be disabled; this adds the ability to reduce power consumption in software. table 3-5: push button switch input assignments 3.2.8 potentiometer a 100 k ? potentiometer (r9) is connected to an12 for all pic24f devices. it can be adjusted from v dd to v ss to provide an analog input voltage to the a/d converter. on pic24f k-series flash devices, the potentiometer also provides a reference volt- age for the high-low voltage detect (hlvd) module. hlvd is not implemented on j-series flash devices. 3.2.9 user-defined leds the board features one yellow and one red led (d2 and d3) that can serve as user-defined outputs. d2 is connected to the rb8 port pin for all pic24f devices. d3 is connected to rb15 on k-series flash devices only. ensure the correct device family is selected on switch, s4. 3.2.10 serial eeprom a 24aa256 256 kb (32 kbytes x 8) serial eeprom (u6) is connected to i2c1 for both pic24f 20-pin and 28-pin devices. it is used to demonstrate i 2 c? bus operation. it is included for nonvolatile firmware storage, in addition to the internal data eeprom of the pic24f16ka102. the sda and scl signals for the i 2 c bus are available to the user at test points near u6 and at take-off points adjacent to the prototype area. 3.2.11 temperature measurement options the xlp 16-bit board features two different temperature sensing options. an mcp9700 analog output thermistor (u4) is connected to a pic ? mcu a/d converter input (an1). the thermistor?s output voltage has a linear correlation to the temperature. the thermistor is disconnected from the microcontroller by removing jumper, jp5. to use i/o pins efficiently, the thermistor is multiplexed with capacitive touch pad 3. avoid contact with this pad during temperature measurements to minimize effect on temperature measurement accuracy. the xlp 16-bit board also implements a conventional junction diode connected to an analog input to demonstrate low-cost temperature sensing. the charge time measurement unit (ctmu) provides a specified current to the diode; an a/d conver- sion determines the voltage across the diode. this voltage has a linear correlation to the diode?s temperature. for more information on this solution, refer to tb3016, ? using the pic ? mcu ctmu for temperature measurement ? (ds93016) for more information. the xlp 16-bit demonstration software implements both the mcp9700 and diode ctmu measurement solutions via a compile-time opt ion. by default, the mcp9700 is used. note that when switching to the diode temperature measurement, it may be necessary to cali- brate the measurement by changing the di ode calibration constants to account for part-to-part variation in the diode. switch input ports note 28-pin 20-pin s2 rb7/int0 ra6/cn8 internal weak pull-ups required s3 rb14/cn12 n/c xlp 16-bit development kit user?s guide ds51873b-page 26 ? 2010 microchip technology inc. 3.2.12 capacitive sense socket the socket, labeled ?cap sense?, permits the easy connection of a capacitive load to the input of the charge time measurement unit (ctmu). it connects to analog input, an0, for 28-pin devices and an10 for 20-pin devices. it can be used to demonstrate ctmu measurements for capacitance, time and voltage. for additional information on measuring capacitance with the ctmu, refer to section 11. ?charge time measurement unit (ctmu)? (ds39724) of the ? pic24f family reference manual? . 3.2.13 usb connectivity the 16-bit xlp board includes a pic18f14k50 usb microcontroller (u2) which pro- vides usb connectivity and uart-to-usb protocol translation. the pic18f14k50 is hard-wired to the pic24f rx and tx pins, and communicates with the pic24f device through its uart. the usb uart translation software is available in the usb stack release. the pic18f14k50 is clocked independently from the pic24f microcontroller. it uses its own 12 mhz crystal (y3). 3.2.14 rs-232 serial port options the xlp 16-bit board supports two types of rs-232 transceivers and associated sup- port circuitry through a standard db9 connector. this port is configured as a dce device and can be connected to a pc using a straight-through cable. hardware flow control is not supported. as shipped, the serial port circuitry and db9 connector are not populated; instead, usb is used to communicate to the host pc. by supporting two transceivers, the user can choose between a low-cost solution based on the max3221 (3.0v to 5.5v) or a wide voltage range (1.8v to 5.5v) solution using the ltc2801. for operation at the low end of the board?s v dd range (1.8v to 2.0v), the max2331 is below its minimum specified operating voltage. it is recommended that the ltc2801 circuit be populated in this circumstance. the pic24f microcontroller?s tx and rx pins are also connected to the pic18f14k50 rx and tx pins, and are used to convert the uart communication to usb. when the rs-232 option is implemented, remove the zero ohm resistor, r27, to avoid contention with the pic18f14k50. 3.2.15 modular expansion connector the xlp 16-bit board implements a 28-pin modular expansion interface (j7). although physically similar to the pictail? interface available on many microchip demo and development boards, it does not implement the full range of signals sup- ported by the pictail interface. the connector pin assignments for j7 are shown in appendix a. ?development kit schematics? . the xlp board?s interface allows the board to provide basic generic functionality to select pictail modules (listed below), and also be forward compatible with new pictail technologies. the user will need to review new modules as they become available to determine their compatibility with the xlp 16-bit board. in order to use the software for compatible pictail modules, the pin assignments defined in software will need to be remapped to those implemented in the interface. this typically requires minor changes to the header file ( .h ) of the software stack. note 1: the 100 k ? potentiometer is multiplexed with pin 19 of the connector. it is recommended to turn the potentiometer to its highest resistance setting to minimize the load on that pin?s signal. 2: due to the limited availability of i/o ports on 20-pin pic24f devices, the modular expansion interface does not support these devices. xlp 16-bit development board hardware ? 2010 microchip technology inc. ds51873b-page 27 3.2.15.1 compatible pictail daughter boards at the time of the writing of this user?s guide, the following pictail daughter boards were compatible with the xlp 16-bit development board through the modular interface: ? pictail daughter board for sd and mmc (microchip part number ac164122) ? speech playback daughter board (microchip part number ac163027-4) ? mrf49xa pictail plus daughter cards (microchip part numbers ac164137-1 and -2) ? mrf24j40 pictail plus daughter cards (microchip part numbers ac164134-1 and -2) future pictail daughter boards may also be compatible with the interface. it is up to users to evaluate any new boards that they may wish to use for signal compatibility. 3.2.16 programming interfaces two options for on-board programming of the pic24f microcontroller are provided. both are compatible with all of the microcontrollers supported by the xlp development board. the rj-11 socket (j4) supports the standard 6-wire connector for microchip?s mplab icd 2 in-circuit programmer/debugger module. connector, j5, is a standard 6-pin pickit ? 2 programmer interface. this provides a second low-cost programming option in addition to mplab icd 2. in addition, the pic18f14k50 usb microcontroller may be programmed separately from the pic24f device. a dedicated 6-pin interface (j11), located adjacent to the rj-11 interface, is used for the pic18 device. 3.2.17 prototype area to assist in the development and testing of application hardware, the xlp board includes a 15 x 9 prototype area for the installation of the user?s custom circuitry. sources for board power (both v dd _ src and v dd _ brd ) and ground are located adjacent to the area. in addition, the sda and scl signals for the i 2 c lines between the pic24f microcontroller and the serial eeprom have been provided at the unpop- ulated header (j13), adjacent to the prototype area. this allows users to experiment with a multi-device i 2 c bus in their application. 3.3 current measurement one of the great advantages of the xlp 16-bit board is its provisions for in-circuit current measurement. using simple techniques and equipment, users can experiment directly with low-power hardware and software techniques, then directly measure their current consumption without introducing measurement induced artifacts. this provides a fast method of directly validating power-saving strategies. to make measurements more useful, the development board allows for the measurement of microcontroller current draw and non-microcontroller component current separately. 3.3.1 pic24f current measurement to measure current consumed by the pic24f microcontroller, the pic pwr jumper (jp9) can be removed and a current measurement cable connected to its pins. this allows the user to empirically evaluate the microcontroller?s various low-power features. since jp9 interrupts the microcontroller?s v dd path, always be certain to re-install the jumper when measurements are not being taken. xlp 16-bit development kit user?s guide ds51873b-page 28 ? 2010 microchip technology inc. to avoid starving the microcontroller?s current supply and causing low-power conditions, it may be necessary to switch the ammeter to a higher current range during programming and full-power operation. when the microcontroller is operating in a low-power state, switching to a low range will produce a more accurate measurement. as an alternative, two through-hole sockets, marked current measure, have also been placed in the microcontroller?s v dd path. using an appropriately sized resistor will create a voltage drop corresponding to the current being consumed by the microcontroller; this can, in turn, be measured with an oscilloscope. to do this: 1. calculate the size of the resistor required to produce the voltage drop using the v dd and estimated current consumption (found in the electrical specifications of the device data sheet). 2. connect the resistor across the through-hole sockets. 3. connect the scope?s probes across the terminals of jp9. 4. with the appropriate power supply connected and the scope configured for differential voltage mode, remove the pic ? mcu pwr jumper. (this sequence provides continuous microcontroller power and avoids a spurious bor or por event.) the resulting waveform will be a scalar representation of the current consumed by the pic24f device. this technique is especially useful for evaluating microcontroller power over a time interval. 3.3.2 component power measurement the ic pwr jumper (jp10) allows the user to measure the current consumed by the various board components. it also permits the user to experiment with low-power techniques on a variety of commonly used components. current measurements taken at jp10 exclude current consumption from the micro- controller, icsp? header and the usb interface. therefore, communications with a host pc and emulator/programmer connections do not need to be accounted for in determining an accurate current measurement, as they are not included in the first place. since jp10 interrupts the v dd path to the board?s other components, always be certain to re-install the jumper when measurements are not being taken. 3.3.3 ammeter tool header the xlp 16-bit board includes a special 7-pin header (j10) for current measurement. the pic mcu pwr and ic pwr jumpers (jp9 and jp10) ensure continuity of power when connecting or disconnecting a current measurement device. microchip provides an optional xlp current measurement cable (part number AC002023) as a convenient way of connecting the header to an ammeter. note: since the resistor is placed in series with the pic mcu v dd pin, the resulting voltage drop may affect power calculations. ensure calculations are based on actual v dd , instead of the supplied board voltage. xlp 16-bit development kit user?s guide ? 2010 microchip technology inc. ds51873b-page 29 appendix a. development kit schematics the following schematic diagrams are included in this appendix: ? figure a-1: microcontroller sockets/headers and associated components ? figure a-2: usb/serial interface, eeprom, temperature sensors and 28-pin interface ? figure a-3: power circuit and selector jumpers ? figure a-4: unpopulated circuits (rs-232 and i 2 c header) xlp 16-bit development kit user?s guide ds51873b-page 30 ? 2010 microchip technology inc. figure a-1: development board schematic, sheet 1: microcontroller sockets/headers and associated components osco an5 u2rx u2tx an0 mclr mclr vdd_pic osci an1 ra0 pgd pgc rb7 sosci sda ra7 sdi sck sdo rb14 sosco scl r a6 hlvdin rb15 vdd_pic pic24fxxk/j 28-pin socket pwr-ctrl sosco sosci osci u2rx an5 pgd mclr osco pgc u2tx scl rb7 hlvdin an0 rb15 vdd_pic sda pwr-ctrl an1 sosco osci osco sosci hlvdin an0 vdd_brd_r9 rb14 rb 7 rb15 ra6 led3 pwm vcap pwm vdd_pic pgd mclr pgc vdd_src an0 an5 an1 led3 vdd_br d scl vdd_brd development kit schematics ? 2010 microchip technology inc. ds51873b-page 31 figure a-2: development board schematic, sheet 2: usb/serial interface, eeprom, temperature sensors and 28-pin interface vdd_brd_u 6 scl sda u2rx vreg0 u2tx lvpk50 mclrk50 pgcd- vreg0 pgcd+ pgcd- pgcd+ vreg0 mclrk50 lvpk50 vreg0 sda an5 an0 pwm scl rb14 hlvdin rb14 sck sdi vdd_brd_pictail sdo an1 vdd_brd_u4 ac and usb power modes only pic18f14k50 xlp 16-bit development kit user?s guide ds51873b-page 32 ? 2010 microchip technology inc. figure a-3: development board sche matic, sheet 3: power circuit and selector jumpers digital ground pgcd+ pgcd- adj vreg0 pgd vdd_src vdd_br d vdd_src pgd vdd_pic analog ground vbus aaax2 h arvest pgc 2032 vdd_br d pgc harvest vdd_brd_pictail vdd_brd_r 9 vdd_brd_u 4 vr eg0 pgd pwr-ctrl vdd_brd_r s232 vdd_brd_u 6 ap1115byl vcap ra7 vdd_pic vdd_pic not populated not populated see table for appropriate values development kit schematics ? 2010 microchip technology inc. ds51873b-page 33 figure a-4: development board schemati c, sheet 4: unpopulated circuits (rs-232 and i 2 c? header) u2tx vdd_brd_rs232 u2rx u2tx vdd_brd_rs232 8 r1in 3 5 12 forceon 1 en 16 14 gnd 2 c1+ 15 4 c1- 6 c2- 7 v- 10 invalid 9 r1out 11 t1in 13 t1out sda scl vdd_brd xlp 16-bit development kit user?s guide ds51873b-page 34 ? 2010 microchip technology inc. notes: xlp 16-bit development kit user?s guide ? 2010 microchip technology inc. ds51873b-page 35 index a ammeter tool header.............................................. 28 b board features ........................................................ 12 board layout............................................................ 13 c capacitive measurement point ................................ 12 capacitive sense socket ......................................... 26 capacitive touch pads .......................................12 , 24 component power measurement ............................ 28 component power switch........................................ 22 component select jumpers................................12 , 24 current measurement jumpers, access point......... 12 customer notification service.................................... 8 customer support ...................................................... 9 d demonstration program ........................................... 14 configuration options ....................................... 19 operation .......................................................... 17 software flowchart ........................................... 18 documentation conventions........................................................ 6 layout ................................................................. 5 driver and software installation ............................... 15 i ic power control switch .....................................12 , 22 initial board configuration........................................ 15 internet address......................................................... 8 l ldo regulator ....................................................12 , 23 m master clear reset (mclr ...................................... 24 master clear switch ................................................. 12 microchip internet web site ....................................... 8 modular expansion connector................................. 12 compatible boards ........................................... 27 modular expansion connector................................. 26 o on-chip regulator configuration (pic24f) ............. 12 on-chip regulator configuration (pic24fj) ........... 23 oscillator options..................................................... 12 p pic24f current measurement ....................................... 27 feature availability by device family ............... 21 oscillator options.............................................. 21 processor support ............................................ 21 pic24f device sockets ........................................... 12 potentiometer..................................................... 12 , 25 power led ......................................................... 12 , 23 power source select................................................ 22 power sources................................................... 12 , 22 programming interfaces..................................... 12 , 27 prototype area ................................................... 12 , 27 r reading, recommended ........................................... 7 readme...................................................................... 7 reference documents ............................................. 14 revision history ......................................................... 9 rs-232 options........................................................ 26 s schematic diagrams ................................................ 29 serial eeprom ................................................. 12 , 25 serial terminal configuration................................... 16 t temperature measurement options ........................ 25 temperature sensors .............................................. 12 u usb connectivity ..................................................... 26 usb interface........................................................... 12 user-defined leds ............................................ 12 , 25 user-defined push buttons...................................... 12 user-defined switches............................................. 25 w warranty registration ................................................ 7 www address........................................................... 8 ds51873b-page 36 ? 2010 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://support.microchip.com web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit farmington hills, mi tel: 248-538-2250 fax: 248-538-2260 kokomo kokomo, in tel: 765-864-8360 fax: 765-864-8387 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 santa clara santa clara, ca tel: 408-961-6444 fax: 408-961-6445 toronto mississauga, ontario, canada tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2401-1200 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8528-2100 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - hong kong sar tel: 852-2401-1200 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8203-2660 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-2566-1512 fax: 91-20-2566-1513 japan - yokohama tel: 81-45-471- 6166 fax: 81-45-471-6122 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-6578-300 fax: 886-3-6578-370 taiwan - kaohsiung tel: 886-7-536-4818 fax: 886-7-536-4803 taiwan - taipei tel: 886-2-2500-6610 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 uk - wokingham tel: 44-118-921-5869 fax: 44-118-921-5820 w orldwide s ales and s ervice 01/05/10 |
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